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INSIGHT FOR REFLOW TRACKER analysis software for all electronics assembly profiling tasks including Reflow, Wave and Vapour phase soldering |
RAPID OVEN SETUP (ROS) Let the software find the optimum oven recipe settings |
SURVEYOR easy to use fully automated process stability and capability monitoring system |
EASY OVEN SETUP (EOS) |
Every time a new product or solder paste is introduced, the reflow oven settings have to be optimized. This task is time consuming and is usually performed by an experienced process engineer. Rapid Oven Setup from Datapaq will automate this process by calculating the optimum oven settings for any given product and target profile.
Rapid Oven Setup will:
- Ensure the optimum profile is used.
- Speed up the changeover to new profiles (lead free!)
- Help reduce scrap levels.
- Save time and money at each product introduction.
- Check oven/product compatibility offline.
- Works on all ovens—old or new—IR or convection
The Rapid
Oven Setup software package uses Wizards to guide the user step-by-step
through all procedures.
Click HERE
to download Rapid Oven Setup demo software.
“Right
First Time” profiles
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When setting up a reflow oven for a new product or profile, the process engineer will generally assess three pieces of information:
- The performance of the oven to be used.
- The thermal mass and mass distribution of the product to be soldered.
- The shape of the thermal profile to be achieved.
These three sets of data form the input to the mathematical model that is the heart of the Rapid Oven Setup system. The model divides the product into hundreds of elements, and uses finite difference methods to calculate the thermal response for every element. The software will then use this information to calculate the optimum recipe for the specified target profile.
The result is “right
first time” profiles with no need to waste time connecting thermocouples
to a PCB and trying multiple recipe combinations.
A thermal profile is calculated for every element
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Despite the great
improvements that have been made in reflow oven design, no two ovens are
exactly the same. This variation complicates the task of setting up an
oven. The Datapaq ROS system overcomes this problem by measuring the actual
performance of the oven. This means that the system will work with all
types of reflow ovens. This measurement of oven performance (characterization
of the oven) enables the software to account for calibration errors in
the zone settings, as well as the influence that each zone has on neighboring
zones.
The thermal mass and mass distribution of the
product to be soldered
The total thermal
mass and the thermal mass distribution have a significant effect on the
oven settings required to achieve a given profile. As component packaging
technologies advance and component placement densities increase, the ability
to profile the entire assembly becomes increasingly important. The Rapid
Oven Setup system can read the CAD files used to design the PCB assembly
and use this information to calculate the thermal mass distribution of
the assembly. Now for the first time this data can be used to optimize
the reflow soldering process.
Click image for larger picture
Click
image for larger picture
The shape of the
thermal profile to be achieved
The design of the target profile is influenced by many factors. The usual starting point is the profile supplied by the manufacturer of the solder paste. The process manager will then add any further limitations that are imposed either by the components used in the assembly or internal company standards. The Rapid Oven Setup system has a very easy to use wizard-based interface that enables the user to design target profiles, displaying the critical data in both graphical and numerical form.